Something About the Flexible Print Circuit Board(FPCB) You Should To Know

FPCB, all known Flexible Print circuit board or Flex Print circuit Board, it is attached to the flexible substrate on the dry film, exposed, developed, produced on the substrate after etching conduction lines. In terms of its relative rigid printed circuit boards can be curved flexible, smaller and lighter. In electronic products play a role in conducting and bridges make the product better performance, smaller.

Main material: polyimide + adhesive + copper are also non-adhesive backing, which only copper + substrate, its price is higher, less in the current application, unless special needs.

Copper CU (Copper Foil) in the material is divided into rolled copper RA (ROLLED ANNEAL Copper Foil) and electrolytic copper ED (ELECTRO DEPOSITED Copper Foil) two kinds, the characteristics of the mechanical properties of rolled copper is better, there are scratch off most requests are made rolled copper. Thickness is divided into 1/2oz (0.7mil), 1oz, 2oz, three are generally used 1oz.

Substrate in the material is divided into PI (Polyimide) Film and PET (Polyester) Pilm two kinds, PI's price is higher but its better flame resistance, PET lower prices but not heat. So if it needs most are made of welded PI Material thickness is divided into two kinds of 1mil 2mil.

Reinforcing material Stiffener soft board soldered parts or local area in order to increase reinforcement in order to install and another pressing up of hard material reinforced PI and PET film is divided into two kinds of materials as Epoxy FR4 material commonly known as urea resin plate reinforcement materials in general are feeling Caulking RESSURE SENSITIVE ADHESIVE fit with soft board, but you are using PI reinforcement film adhesive (Thermosetting) lamination.

Surface treatment

1. Rust treatment - on the surface of bare copper antioxidants
2. Tin-lead printing - the bare copper surface with solder paste printing another reflow furnace
3. Plating - Plating Tin / lead (Sn / Pb) nickel / gold (Ni / Au)
4. Chemical deposition - chemical solution deposition way to tin / lead nickel / gold surface treatment

Features:

Can be curved flexible, small footprint, light weight, stable transmission characteristics, sealing, insulation, good assembly process

Application areas:

Automation instrumentation, office equipment, communications equipment, automotive instrumentation, aerospace instrument, cameras and other PCB board .

Classification:

(1)According to sub-layers: * Single Layer board * Double layer board * Multilayer board (two or more layers)
(2) By material: * Soft board * Rigid PCB board * Rigid-Flex PCB board